tsv怎么记

The methods of3D interconnection can be classified into the wire bonding, flip chip, through silicon via ( TSV) and film wire technology, whose advantages and disadvantages are analyzed.

将实现3D互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。

Electromagnetic transport measurements show that the thermal stability behavior for NiO being on the top of the spin valve ( TSV) is different from that for NiO being under the bottom of the spin valve ( BSV).

电磁输运测量表明，对相同Co/Cu/Co结构的自旋阀，NiO在自旋阀的顶部（TSV）和在自旋阀的底部（BSV）表现了不同的磁电阻值和热稳定特性。

TSV technology mostly used the ICP-RIE process, and using MEMS technics in future main packaging would speed up MEMS industry.

TSV技术主要采用ICP-RIE工艺，将MEMS技术应用于未来的主流封装技术将会进一步加快MEMS产业的速度。