QFN的音标

The bonding force between the Cu deposition and substrate can reach 5B grade even after the thermal shock test and the cut by using high-speed grinding wheel of the QFN process.

镀铜层与基底间的结合力可以达到5B级，在经过热冲击试验和QFN封装工艺的高速砂轮线切割操作后，结合力都达到5B级。

The research in this thesis is supported by the National Natural Science Foundation Project. The structure and dimension parameters of Quad Flat no-lead package ( QFN) devices has been optimized and analyzed.

本文依托于国家自然科学基金项目微电子封装中的界面层裂失效和界面强度可靠性设计方法，对四方扁平无引脚封装（QFN）器件进行了结构尺寸参数优化和分析。

Analysis on Thermal-mechanical Stress and Moisture Driven Delamination in the QFN Package Devices

热–机械应力和湿气引起QFN器件层间开裂分析